芯片SIP封装与工程设计

芯片SIP封装与工程设计

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Bibliographic Details
Main Author: 毛忠宇编著
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Published: 清华大学出版社

开架借阅区

Holdings details from 开架借阅区
Call Number Barcode Status Location
TN405.94/18 33046540 Available 三楼开架借阅一区6排B面4列1层

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